New feature: Cable & line temperature about gridcal HOT 6 CLOSED

This one should be simple enough.

I have always had another formula in the back of my head.

Formula 4.4 from here

This was used by consultants back when I worked at KEMA in the Netherlands.

This one should be used in processes with temporal dependency. It indicates how the cable heats up.

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That's a nice reference, I'll look further into it. We do perform heat dissipation studies for buried cables, either transient or steady-state, but we also sometimes need to simply run a simulation at a certain fixed temperature using the formulas from my 1st post.

I'll work on integrating my other unit tests first, but I could indeed integrate this one as well rather easily when I get a chance. I would probably leave the GUI integration to you though, I admit I've never even tried it (I love the CLI!).

Thanks.

Edit: Your formula could be integrated as a "second phase", once the basic temperature resistance adjustment is fully integrated.

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Hi,
I have implemented the simple temperature correction.

The temperature Tc is temperature in MultiCircuit
Tc and k are new branch parameters to model the base temperature and the conductor "thermal constant" (I called it that)

The option to use this correction is implemented as an option in PowerFlowOptions

In the GUI the temperature in a double spin box and there is a check to activate the temperature correction.

I have tested it very lightly and it does change the loading indeed. So if you can test it better against ETAP it'll be great.

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Actually, looking for the formula to change resistance I found the following formula:

R = R0 * (1 + k * (T0 - T))

Where k can be:

• Copper = 0.004041
• Aluminum = 0.004308
• Iron = 0.005671
• Nickel = 0.005866
• Gold = 0.003715
• Tungsten = 0.004403
• Silver = 0.003819

Being measured in 1/ºC.

See here for the reference.

Do you have any reference for the first formula?

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My reference is closed (in ETAP's help), so not really adequate for an open-source project. I'll ask them what their own reference was and hopefully it'll point to an IEEE standard or publication.

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Closing because of #38 and #53

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