• RD15HVF1 push-pull 30W linear amplifier.
• A retired notebook AC adaptor is used to supply 19.5V to RD15HVF1.
• Tx/Rx LPF and Rx HPF ; same control as N2ADR filter
• FWD/REV sensor ; Alex type
• Tx RF feedback path for PureSignal.
• Phones and Mic Jacks are placed on the front panel, and CW key jack on the rear.

• Tx Power with comparison of RD15HVF1s and RD16HHF1s
  Tx power is lower if RD16s is used instead of RD15s.
• Thetis FWD Power Meter
• Spur at 30W 160M , 80M , 40M , 20M , 15M
• PureSignal at 30W ON, OFF

There are some errata on my 1st design (v1). Schematic and pcb layout have been revised to fix them. There is no DRC error on KiCad but these are not actually build and verified.

• Schematic
• BOM
• Gerber
• PA30-HL2 board connection

• Trans and coil
  T1 , T2 , L1
  T3, T4 : UEW 0.32mm
  LPF 160M, 80M : UEW 0.5mm
  LPF 40M, 30/20M, 17/15M, 12/10M : UEW 0.6mm
• RD15HVF1 grounding
  It's necessary to connect RD15HVF1 source tab to GND pattern of PCB shortly. Otherwise amplifier will not work well. eg. lower power output... Copper tape is used. ( Photo )
• RD15HVF1 idle current
  Q1, Q2 idle current is set to 250mA per Tr (total 500mA).

• Reduce HL2 RF output power to avoid over drive ; 37dBm -> 26dBm
  R55 : Replace 120ohms with 750ohms. Otherwise Q1 and Q2 will be broken.

• uFL Tx output
  RF7 and B55 : Install
  B98 : Uninstall

• uFL Rx input
  RF5 : Install
  B81 : Uninstall

• CW KEY jack
  Jack(CN4) and jumper(J13) : Uninstall to get clearance to jacks on CBV3. ( Photo )
  Instead of the uninstalled jack CN4, 3.5mm jack is placed on rear panel. ( Photo )
  Wire is used to connect between PCB and the jack.

• Pin Header
  Low profile pin header and socket are used. ( Photo )
  CN1, DB1, DB12, DB13, DB7 Pin12-14 ( Photo )

• Stacked boards Photo

• Mic/PTT jack and Phone jack
  They are relocated on the opposite PCB side. ( Photo )
  Therefore the signals assigned to Tip and Ring are swapped.
  C3 10uF on CBV3 is removed to mount Mic/PTT jack. There is no side effect in my case.

• Pin Header
  Low profile pin header and socket are used. ( Photo )

• Jack Spacer (option)
  The B2B Pin Header/Socket height and jack height are different.
  Therefore 3D printed spacer (t = 0.7mm) is used between jack and PCB to fix tightly. ( Photo )

• CVB3 Support part (option)
  The 3D printed support part that fixes CBV3 and HL2 tightly, is used. ( Photo )

• 40mm square. ( Photo )

• This is risk hedge. I have not verified if it's essencial or not.
• Relay shield (copper tape is used) intend to isolate LPF input and output, and to isolate Tx and Rx. ( Photo )
• 3D printed shield between HL2 and PA30
  Aluminum tape is used. ( Photo )

• Jack spacer
• CBV3 support
• B2B Shield
• Front Panel
• Rear Panel
• HL2 spacer instead of N2ADR board